Features & Benefits

  • Transfers 24 to 26 each silicon wafers between one standard pitch plastic cassette and one non-standard pitch process boat in a contact back-to-back configuration.
  • The machine may be configured to accommodate a large diversity of Plastic, Teflon®, metal, Quartz,
    Silicon Carbide and Polysilicon carriers.
  • Machine interface is a 12 key pad with a 4 line LCD Display.
  • Designed to limit particle contamination by using lead screw drive and stepper motor, “clean room grade” rails and bearings and electric boat sensors.
  • All aluminum parts are hard black anodized for corrosion resistance.
  • Electronic through beam sensors are used to detect wafer presence in boats and retainers thus
    preventing accidental double loading and scratches.
  • Lift system uses ramped speed controls for gentle pick-up and landing.
  • Pressure sensors are used for both personal safety and machine safety by inhibiting machine operation.
  • Retainers default to closed position to prevent dropping wafers in the event of electrostatic discharge, loss of power, or loss of air pressure.
  • A pause function is provided to stop the lift system at any position to facilitate preventative maintenance and cleaning.
  • Uptime will exceed 99.25%.
    • MTBF (mean time between failure): 100,000 wafers
    • MTBA (mean time between assist): 25,000 wafers
    • MTTR (mean time to repair): less than 1 hour


  • RS232 communications port
  • Recessed mounting
  • Vespel package for high temperature applications
  • Stainless steel covers
  • Hot boat sensor